Co-Packaged Optics (CPO) refers to an architectural approach in which optical engines are integrated directly adjacent to, or within the same package as, switch ASICs or compute processors. The objective is to significantly shorten electrical interconnects, enabling higher data rates, lower latency, and improved signal integrity.

CPO designs are considered a key enabler for AI clusters, hyperscale data centers, HPC systems, and future network architectures, as they significantly increase bandwidth density and energy efficiency. However, this compact integration places the highest demands on precision, miniaturization, thermal stability, and optical packaging—a central challenge in modern photonics development.